Date/Time
Date(s) - 22/07/2020
10:00 am - 11:00 am
Categories
Series overview:
CSA Catapult is pleased to present this four-part, weekly webinar series which will cover the essentials of Semiconductor packaging technology. The webinars, led by Andy Longford, will allow participants to gain a thorough insight into the wide range of technological developments, that are currently involved in this industry sector and are enabling future innovations.
An Essential Guide to Packaging Technology will take an in-depth look at the following areas:
Part 1: Evolution of chip packaging
Part 2: Packaging the (CS) applications
Part 3: Essential Packaging processes
Part 4: Advanced Packaging Trends
An Essential Guide to Packaging Technology: Advanced Packaging Trends
Wed 22/07/20
To conclude the Essential Guide to Packaging Technology series, this webinar will investigate the trends that are evolving in the field of Advanced Packaging. This session will share how these capabilities are developing to meet the growing demands of future applications, and supporting the need for smaller, faster, and lower cost components.
Presenter: Andy Longford C.Eng FIET Packaging Strategy Advisor– CSA Catapult
Andy Longford has been working in the Semiconductor Packaging and Assembly industry for over 30 years, involved in package design, development and assembly projects including LED, MEMS and Power devices, for applications in Automotive, industrial and Consumer products, as well as Aerospace and Defence related products. He has authored over 30 technical papers on Electronics Interconnect, Chip Packaging and Lead-Free electronics developments, with 15 technical articles published and numerous presentations made at conferences worldwide. He is an EPSRC College peer review member, a registered EU Research Project evaluator and has served on a number of UK Government technical committees. His role at the Catapult is to support the Advanced Packaging team with strategic planning, technology training and roadmap development
